Global Advanced Packaging Market Size & Outlook, 2025-2030
Global advanced packaging market, 2018-2030 (US$M)
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Global advanced packaging market highlights
- The global advanced packaging market generated a revenue of USD 39,595.7 million in 2024 and is expected to reach USD 55,000.3 million by 2030.
- The market is expected to grow at a CAGR (2025 - 2030) of 5.7% by 2030.
- In terms of segment, flip-chip accounted for a revenue of USD 16,144.2 million in 2024.
- Embedded-Die is the most lucrative packaging type segment registering the fastest growth during the forecast period.
- In terms of region, Asia Pacific was the largest revenue generating market in 2024.
- Country-wise, Mexico is expected to register the highest CAGR from 2025 to 2030.
Global data book summary
| Market revenue in 2024 | USD 39,595.7 million |
| Market revenue in 2030 | USD 55,000.3 million |
| Growth rate | 5.7% (CAGR from 2025 to 2030) |
| Largest segment | Flip-chip |
| Fastest growing segment | Embedded-Die |
| Historical data covered | 2018 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Flip-Chip, Fan-Out WLP, Embedded-Die, Fan-In WLP, 2.5D/3D |
Other key industry trends
- In terms of revenue, the North America accounted for 27.9% of the global advanced packaging market in 2024.
- By country, the U.S. is projected to lead the global market in terms of revenue in 2030.
- By country, Mexico is the fastest growing regional market and is projected to reach USD 1,276.5 million by 2030.
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Advanced Packaging Market Scope
Advanced Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Yole Global | View profile | 51-100 | Singapore, Central Region, Singapore, Asia | https://www.yole.com |
| IPC Systems | View profile | 1001-5000 | Alpharetta, Georgia, United States, North America | http://www.ipc.com |
| JCET Group | View profile | 10001+ | Jiangyin, Jiangsu, China, Asia | https://jcetglobal.com |
| ASMPT | View profile | 10001+ | Singapore, Central Region, Singapore, Asia | http://www.asmpt.com |
| Prodrive Technologies | View profile | 1001-5000 | Son, Noord-Brabant, The Netherlands, Europe | https://prodrive-technologies.com/ |
| Semios | View profile | 101-250 | Vancouver, British Columbia, Canada, North America | http://semios.com |
| ASE Technology Holding Co Ltd ADR | View profile | 91568 | No. 26, Chin Third Road, Nanzih District, Kaohsiung, Taiwan, 811 | https://www.aseglobal.com |
| Amkor Technology Inc | View profile | 28700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | https://www.amkor.com |
| Taiwan Semiconductor Manufacturing Co Ltd | View profile | 76478 | No. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan, 300-096 | https://www.tsmc.com |
| Samsung Electronics Co Ltd | View profile | 124804 | 129, Samsung-ro, Yeongtong-gu, Gyeonggi-do, Suwon-si, Korea, Republic of, 443-742 | https://www.samsung.com |
| Intel Corp | View profile | 124800 | 2200 Mission College Boulevard, Santa Clara, CA, United States, 95054-1549 | https://www.intel.com |
Global advanced packaging market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to advanced packaging market will help companies and investors design strategic landscapes.
Flip-chip was the largest segment with a revenue share of 40.77% in 2024. Horizon Databook has segmented the Global advanced packaging market based on flip-chip, fan-out wlp, embedded-die, fan-in wlp, 2.5d/3d covering the revenue growth of each sub-segment from 2018 to 2030.
- Global Advanced Packaging Packaging Type Outlook (Revenue, USD Million, 2018-2030)
- Flip-Chip
- Fan-Out WLP
- Embedded-Die
- Fan-In WLP
- 2.5D/3D
- Others
- Global Advanced Packaging Application Outlook (Revenue, USD Million, 2018-2030)
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Others
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Our clientele includes a mix of advanced packaging market companies, investment firms, advisory firms & academic institutions.
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Horizon Databook provides a detailed overview of global-level data and insights on the Global advanced packaging market , including forecasts for subscribers. This global databook contains high-level insights into Global advanced packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
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Global advanced packaging market size, by regions, 2018-2030 (US$M)
Top 10 countries: Advanced packaging market size, 2024 (US$M)
Global advanced packaging market share, by packaging type, 2024 & 2030 (%, US$M)
Advanced packaging market: Opportunity assessment by country
Global advanced packaging market, by region, 2024 (US$M)
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