Asia Pacific Semiconductor Wafer Polishing And Grinding Equipment Market Size & Outlook
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Asia Pacific semiconductor wafer polishing and grinding equipment market highlights
- The Asia Pacific semiconductor wafer polishing and grinding equipment market generated a revenue of USD 1,927.3 million in 2024.
- The market is expected to grow at a CAGR of 5.1% from 2025 to 2030.
- In terms of segment, polishing machine was the largest revenue generating product in 2024.
- Polishing Machine is the most lucrative product segment registering the fastest growth during the forecast period.
- Country-wise, China is expected to register the highest CAGR from 2025 to 2030.
Asia Pacific data book summary
| Market revenue in 2024 | USD 1,927.3 million |
| Market revenue in 2030 | USD 2,583.3 million |
| Growth rate | 5.1% (CAGR from 2025 to 2030) |
| Largest segment | Polishing machine |
| Fastest growing segment | Polishing Machine |
| Historical data covered | 2018 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Polishing Machine, Grinding Machine |
| Key market players worldwide | Engis Corporation, Lapmaster Wolters, Tokyo Seimitsu, Shin Nippon Koki, Qingdao Gaoce Technology, Applied Materials Inc, Nachi Fujikoshi, Komatsu Ltd, Ebara Corp |
Other key industry trends
- In terms of revenue, Asia Pacific region accounted for 68.7% of the global semiconductor wafer polishing and grinding equipment market in 2024.
- Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2030.
- Asia Pacific is the fastest growing regional market and is projected to reach USD 2,583.3 million by 2030.
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Semiconductor Wafer Polishing And Grinding Equipment Market Scope
Semiconductor Wafer Polishing And Grinding Equipment Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Qingdao Gaoce Technology | View profile | 1001-5000 | Qingdao, Fujian, China, Asia | http://www.gaoce.cc |
| Shin Nippon Koki | View profile | 501-1000 | Osaka, Osaka, Japan, Asia | https://www.snkc.co.jp/en/ |
| Engis Corporation | View profile | 101-250 | Wheeling, Illinois, United States, North America | http://engis.com |
| Lapmaster Wolters | View profile | 251-500 | Rendsburg, Schleswig-Holstein, Germany, Europe | http://www.peter-wolters.com/ |
| Tokyo Seimitsu | View profile | 1001-5000 | Hachioji, Tokyo, Japan, Asia | https://www.accretech.jp/ |
| Nachi Fujikoshi | View profile | 5001-10000 | Toyama-shi, Toyama, Japan, Asia | http://www.nachi-fujikoshi.co.jp/ |
| Applied Materials Inc | View profile | 34000 | 3050 Bowers Avenue, P.O. Box 58039, Santa Clara, CA, United States, 95052-8039 | https://www.appliedmaterials.com |
| Ebara Corp | View profile | 19629 | 11-1, Haneda Asahi-cho, Ohta-ku, Tokyo, Japan, 144-8510 | http://www.ebara.co.jp |
| Komatsu Ltd | View profile | 70608 | 3-6 Akasaka 2-chome, Minato-ku, Tokyo, Japan, 107-8414 | https://www.komatsu.jp |
Asia Pacific semiconductor wafer polishing and grinding equipment market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to semiconductor wafer polishing and grinding equipment market will help companies and investors design strategic landscapes.
Polishing machine was the largest segment with a revenue share of 67.36% in 2024. Horizon Databook has segmented the Asia Pacific semiconductor wafer polishing and grinding equipment market based on polishing machine, grinding machine covering the revenue growth of each sub-segment from 2018 to 2030.
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Strategic advantage: By staying updated with the latest market intelligence, companies can stay ahead of competitors, anticipate industry shifts, and capitalize on emerging opportunities.
Target buyers of Asia Pacific semiconductor wafer polishing and grinding equipment market databook
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Our clientele includes a mix of semiconductor wafer polishing and grinding equipment market companies, investment firms, advisory firms & academic institutions.
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30% of our revenue is generated working with investment firms and helping them identify viable opportunity areas.
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Approximately 65% of our revenue is generated working with competitive intelligence & market intelligence teams of market participants (manufacturers, service providers, etc.).
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The rest of the revenue is generated working with academic and research not-for-profit institutes. We do our bit of pro-bono by working with these institutions at subsidized rates.
Horizon Databook provides a detailed overview of continent-level data and insights on the Asia Pacific semiconductor wafer polishing and grinding equipment market , including forecasts for subscribers. This continent databook contains high-level insights into Asia Pacific semiconductor wafer polishing and grinding equipment market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
Partial client list
Asia Pacific semiconductor wafer polishing and grinding equipment market size, by country, 2018-2030 (US$M)
Asia Pacific Semiconductor Wafer Polishing And Grinding Equipment Market Outlook Share, 2024 & 2030 (US$M)
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