Middle East & Africa Wafer Level Packaging Market Size & Outlook
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MEA wafer level packaging market highlights
- The MEA wafer level packaging market generated a revenue of USD 169.0 million in 2024.
- The market is expected to grow at a CAGR of 9.7% from 2025 to 2030.
- In terms of segment, 3d tsv wlp was the largest revenue generating type in 2024.
- 3D TSV WLP is the most lucrative type segment registering the fastest growth during the forecast period.
- Country-wise, Saudi Arabia is expected to register the highest CAGR from 2025 to 2030.
MEA data book summary
| Market revenue in 2024 | USD 169.0 million |
| Market revenue in 2030 | USD 292.4 million |
| Growth rate | 9.7% (CAGR from 2025 to 2030) |
| Largest segment | 3d tsv wlp |
| Fastest growing segment | 3D TSV WLP |
| Historical data covered | 2018 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | 3D TSV WLP, 2.5D TSV WLP, Wafer Level Chip Scale Packaging (WLCSP), Nano WLP |
| Key market players worldwide | Amkor Technology Inc, Taiwan Semiconductor Manufacturing Co Ltd ADR, MKS Instruments Inc, ULVAC Inc, Micross Components, KLA Corp, Bruker Corp, Nordson Corp, Asahi Kasei Corp |
Other key industry trends
- In terms of revenue, MEA region accounted for 2.1% of the global wafer level packaging market in 2024.
- Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2030.
- Asia Pacific is the fastest growing regional market and is projected to reach USD 7,804.6 million by 2030.
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Wafer Level Packaging Market Scope
Wafer Level Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| CAPLINQ | View profile | 11-50 | Assendelft, Noord-Holland, The Netherlands, Europe | https://www.caplinq.com |
| ECI Technology Group | View profile | 101-250 | Toronto, Ontario, Canada, North America | https://ecitech.com |
| Jcet | View profile | 10001+ | Jiangyin, Jiangsu, China, Asia | http://www.cj-elec.com/en/?lang=en&flag=1 |
| Nanotronics Imaging | View profile | 101-250 | New York, New York, United States, North America | http://www.nanotronics.co/ |
| MueTec | View profile | 101-250 | Munich, Bayern, Germany, Europe | http://www.muetec.com/index.php |
| SMTA | View profile | 1-10 | Eden Prairie, Minnesota, United States, North America | https://www.smta.org/ |
| Micross Components | View profile | 501-1000 | Orlando, Florida, United States, North America | http://www.micross.com |
| MKS Instruments Inc | View profile | 10200 | 2 Tech Drive, Suite 201, Andover, MA, United States, 01810 | https://www.mksinst.com |
| Amkor Technology Inc | View profile | 28700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | https://www.amkor.com |
| KLA Corp | View profile | 15210 | One Technology Drive, Milpitas, CA, United States, 95035 | https://www.kla.com |
| ULVAC Inc | View profile | 6264 | 2500 Hagisono, Kanagawa, Chigasaki, Japan, 253-8543 | http://www.ulvac.co.jp |
| Taiwan Semiconductor Manufacturing Co Ltd ADR | View profile | 76478 | No. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan, 300-096 | https://www.tsmc.com |
| Nordson Corp | View profile | 7900 | 28601 Clemens Road, Westlake, OH, United States, 44145 | https://www.nordson.com |
| Bruker Corp | View profile | 9707 | 40 Manning Road, Billerica, MA, United States, 01821 | https://www.bruker.com |
| Asahi Kasei Corp | View profile | 48897 | 1-105 Kanda Jinbocho, Chiyoda-ku, Tokyo, Japan, 101-8101 | http://www.asahi-kasei.co.jp |
Middle East & Africa wafer level packaging market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to wafer level packaging market will help companies and investors design strategic landscapes.
3d tsv wlp was the largest segment with a revenue share of 52.6% in 2024. Horizon Databook has segmented the Middle East & Africa wafer level packaging market based on 3d tsv wlp, 2.5d tsv wlp, wafer level chip scale packaging (wlcsp), nano wlp covering the revenue growth of each sub-segment from 2018 to 2030.
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Horizon Databook provides a detailed overview of continent-level data and insights on the Middle East & Africa wafer level packaging market , including forecasts for subscribers. This continent databook contains high-level insights into Middle East & Africa wafer level packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
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MEA wafer level packaging market size, by country, 2018-2030 (US$M)
Middle East & Africa Wafer Level Packaging Market Outlook Share, 2024 & 2030 (US$M)
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