Europe Semiconductor Packaging Market Size & Outlook
The semiconductor packaging market in Europe is expected to reach a projected revenue of US$ 11,407.2 million by 2030. A compound annual growth rate of 10.1% is expected of Europe semiconductor packaging market from 2025 to 2030.
- Packaging & Packaging Solutions
- Packaging Solutions
- Semiconductor Packaging Market Outlook
- Packaging Solutions
Revenue, 2024 (US$M)
$6,457.7
Forecast, 2030 (US$M)
$11,407.2
CAGR, 2025 - 2030
10.1%
Report Coverage
Europe
Global Market
Related Markets
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Europe semiconductor packaging market highlights
- The Europe semiconductor packaging market generated a revenue of USD 6,457.7 million in 2024.
- The market is expected to grow at a CAGR of 10.1% from 2025 to 2030.
- In terms of segment, organic substrate was the largest revenue generating material in 2024.
- Bonding Wire is the most lucrative material segment registering the fastest growth during the forecast period.
- Country-wise, UK is expected to register the highest CAGR from 2025 to 2030.
Europe data book summary
| Market revenue in 2024 | USD 6,457.7 million |
| Market revenue in 2030 | USD 11,407.2 million |
| Growth rate | 10.1% (CAGR from 2025 to 2030) |
| Largest segment | Organic substrate |
| Fastest growing segment | Bonding Wire |
| Historical data covered | 2018 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resins, Ceramic Package, Die Attach Material, Thermal Interface Materials, Solder Balls |
| Key market players worldwide | ASE Group, Amkor Technology Inc, STATS ChipPAC, Siliconware Precision Industries, Powertech Technology Inc, Fujitsu Ltd, ChipMOS TECHNOLOGIES Inc ADR, Intel Corp, Samsung Electronics Co Ltd, Unisem, Interconnect Systems, LG Chem |
Other key industry trends
- In terms of revenue, Europe region accounted for 16.3% of the global semiconductor packaging market in 2024.
- Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2030.
- Asia Pacific is the fastest growing regional market and is projected to reach USD 38,035.9 million by 2030.
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Publish Date: Jan 17, 2025
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Semiconductor Packaging Market Scope
Semiconductor Packaging Market segmentation & scope
Others
Semiconductor Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Fujitsu Ltd | View profile | 124,055 | Shiodome City Center, 1-5-2 Higashi-Shimbashi, Minato-ku, Tokyo, Japan, 105-7123 | www.fujitsu.com |
| Intel Corp | View profile | 124,800 | 2200 Mission College Boulevard, Santa Clara, CA, United States, 95054-1549 | www.intel.com |
| Samsung Electronics Co Ltd | View profile | 124,804 | 129, Samsung-ro, Yeongtong-gu, Gyeonggi-do, Suwon-si, Korea, Republic of, 443-742 | www.samsung.com |
| LG Chem | View profile | 10001+ | Seoul, Seoul-t'ukpyolsi, South Korea, Asia | www.lgchem.com |
| Amkor Technology Inc | View profile | 28,700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | www.amkor.com |
| Powertech Technology Inc | View profile | 8,895 | No.10, Datong Road, HuKou, Hsinchu Industrial Park, Hsinchu, Taiwan, 30352 | www.pti.com.tw |
| ChipMOS TECHNOLOGIES Inc ADR | View profile | 5,396 | No. 1, R&D Road 1, Hsinchu Science Park, Hsinchu, Taiwan | www.chipmos.com |
| ASE Group | View profile | - | Overland Park, Kansas, United States, North America | ase-group.com/ |
| STATS ChipPAC | View profile | 10001+ | Singapore, Central Region, Singapore, Asia | www.statschippac.com |
| Siliconware Precision Industries | View profile | 10001+ | Taichung, T'ai-wan, Taiwan, Asia | www.spil.com.tw |
Europe Semiconductor Packaging Market Outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to Semiconductor Packaging Market Outlook will help companies and investors design strategic landscapes.
Organic Substrate was the largest segment with a revenue share of 46.74% in 2024.
Horizon Databook has segmented the Europe semiconductor packaging market based on organic substrate, bonding wire, leadframe, encapsulation resins, ceramic package, die attach material, thermal interface materials, solder balls covering the revenue growth of each sub-segment from 2018 to 2030.
- Europe Semiconductor Packaging Market Material Outlook (Revenue, USD Million , 2018-2030)
- Organic Substrate
- Bonding Wire
- Leadframe
- Encapsulation Resins
- Ceramic Package
- Die Attach Material
- Thermal Interface Materials
- Solder Balls
- Others
- Europe Semiconductor Packaging Market Packaging Technology Outlook (Revenue, USD Million , 2018-2030)
- Advanced Packaging
- Traditional Packaging
- Europe Semiconductor Packaging Market End-use Outlook (Revenue, USD Million , 2018-2030)
- Consumer Electronics
- Automotive
- Healthcare
- IT & Telecommunication
- Aerospace & Defense
- Others
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Horizon Databook provides a detailed overview of continent-level data and insights on the Europe Semiconductor Packaging Market Outlook, including forecasts for subscribers. This continent databook contains high-level insights into Europe Semiconductor Packaging Market Outlook from 2018 to 2030, including revenue numbers, major trends, and company profiles.
Europe Semiconductor Packaging Market, 2018-2030 (US$M)
Europe semiconductor packaging market statistics, by material, 2018-2030 (US$M)
