| Market revenue in 2024 | USD 913.8 million |
| Market revenue in 2030 | USD 1,737.1 million |
| Growth rate | 11.8% (CAGR from 2025 to 2030) |
| Largest segment | Organic substrate |
| Fastest growing segment | Bonding Wire |
| Historical data | 2018 - 2023 |
| Base year | 2024 |
| Forecast period | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resins, Ceramic Package, Die Attach Material, Thermal Interface Materials, Solder Balls |
| Key market players worldwide | ASE Group, Amkor Technology Inc, STATS ChipPAC, Siliconware Precision Industries, Powertech Technology Inc, Fujitsu Ltd, ChipMOS TECHNOLOGIES Inc ADR, Intel Corp, Samsung Electronics Co Ltd, Unisem, Interconnect Systems, LG Chem |
Publish Date: Jan 17, 2025
Last Updated: Aug 26, 2026
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| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Fujitsu Ltd | View profile | 124,055 | Shiodome City Center, 1-5-2 Higashi-Shimbashi, Minato-ku, Tokyo, Japan, 105-7123 | www.fujitsu.com |
| Intel Corp | View profile | 124,800 | 2200 Mission College Boulevard, Santa Clara, CA, United States, 95054-1549 | www.intel.com |
| Samsung Electronics Co Ltd | View profile | 124,804 | 129, Samsung-ro, Yeongtong-gu, Gyeonggi-do, Suwon-si, Korea, Republic of, 443-742 | www.samsung.com |
| LG Chem | View profile | 10001+ | Seoul, Seoul-t'ukpyolsi, South Korea, Asia | www.lgchem.com |
| Amkor Technology Inc | View profile | 28,700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | www.amkor.com |
| Powertech Technology Inc | View profile | 8,895 | No.10, Datong Road, HuKou, Hsinchu Industrial Park, Hsinchu, Taiwan, 30352 | www.pti.com.tw |
| ChipMOS TECHNOLOGIES Inc ADR | View profile | 5,396 | No. 1, R&D Road 1, Hsinchu Science Park, Hsinchu, Taiwan | www.chipmos.com |
| ASE Group | View profile | - | Overland Park, Kansas, United States, North America | ase-group.com/ |
| STATS ChipPAC | View profile | 10001+ | Singapore, Central Region, Singapore, Asia | www.statschippac.com |
| Siliconware Precision Industries | View profile | 10001+ | Taichung, T'ai-wan, Taiwan, Asia | www.spil.com.tw |
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to Semiconductor Packaging Market Outlook will help companies and investors design strategic landscapes.
Organic Substrate was the largest segment with a revenue share of 46.86% in 2024.
Horizon Databook has segmented the Mexico - North America semiconductor packaging market based on organic substrate, bonding wire, leadframe, encapsulation resins, ceramic package, die attach material, thermal interface materials, solder balls covering the revenue growth of each sub-segment from 2018 to 2030.
Horizon Databook provides a detailed overview of country-level data and insights on the Mexico - North America Semiconductor Packaging Market Outlook, including forecasts for subscribers. This country databook contains high-level insights into Mexico - North America Semiconductor Packaging Market Outlook from 2018 to 2030, including revenue numbers, major trends, and company profiles.