UV Tapes Market Size & Trend Report

UV Tapes Market Size & Trend Analysis By Product (Polyolefin (PO), Polyvinyl Chloride (PVC), Polyethylene Terephthalate (PET)), By Application (Wafer Dicing, Back Grinding), By Region, And Segment Forecasts, 2014 - 2025

Published: January 2017  |  90 Pages  |  Format: PDF  |  Report ID: GVR-1-68038-368-3

Industry Insights

The global UV (Ultraviolet) tapes market size was valued at USD 274.9 million in 2015. UV tapes are a part of pressure sensitive adhesive (PSA) tapes and are characterized by strong adhesion properties. These are used in the electronics industry for wafer dicing, back grinding, PCB grinding, and glass dicing applications. Growing electronics and semiconductor industries are expected to drive the market over the forecast period.

Polyolefin (PO) UV tapes segment held the largest share in the U.S. in 2015. They are known to exhibit strong adhesion properties, along with superior performance in extreme heat and pressure, a courtesy which, they were most widely used. Growing demand for polyolefin UV tapes in the wafer dicing application is expected to drive the industry over the forecast period.

U.S. UV Tapes market, by product, 2014 - 2025 (USD Million)

U.S. UV Tapes market

Product Analysis

This report is classified on the basis of products, into polyolefin (PO), polyvinyl chloride (PVC), polyethylene terephthalate (PET) and others including phenolic film and polypropylene tapes.

The market for polyolefin UV tapes is projected to register the highest CAGR of 9.7% from 2016 to 2025 due to their superior adhesive properties under extreme conditions, as compared to other products. The product is expected to witness increased demand from the emerging countries in the Asia Pacific region.

PVC UV tapes accounted for the second largest share in 2015. The market is driven by growing demand for compact semiconductor and electronic components, which help in reducing the size of the electronic device.

Application Analysis

As seen below, wafer dicing dominated the application segment in 2015 and was valued at over USD 130 million. Wafer dicing is basically a process of separating a die from the wafer of a semiconductor. Polyolefin UV tapes are most commonly used in this application. Growing demand for minute electronic components such as ICs and chips are driving the market in this segment.

Global UV Tapes market, by application, 2015 (%)

Global UV Tapes market

The application of UV tapes in the back grinding process held the second largest share of over 40% in 2015. In this process, the thickness of a wafer can be reduced to less than 25 micro meters, which in turn, helps in minimizing the size of electronic components such as micro-chips.

Regional Insights

Asia Pacific was the largest market accounting for over 50% of the global revenue in 2015. This region witnessed a high growth of the electronics industry in the past few years. Some of the major electronics players including Panasonic, Samsung, Sony, LG, and Hitachi are based in this region. Growing demand for semiconductors and components such as ICs and display units have driven the industry in this region.

The North America market size was over USD 60 million in 2015, the second-largest after Asia Pacific. This region is expected to grow in accordance with the U.S. industry growth. The market in this region is projected to grow in line with the growing electronics industry and awareness regarding the advantages of UV tapes such as high heat resistance. Besides, the fact that they can be recycled, is also expected to play a key role in the growth in this region.

Europe is expected to grow at a relatively slower rate over the forecast period, as the market in most of the countries in this region is mature. However, Germany and France, with growing semiconductor and electronics industries, are expected to exhibit reasonable growth from 2016 to 2025.

Competitive Insights

Some of the major players include Furukawa Electric Co. Ltd., Nitto Denko Corporation, Mitsui Corporation, Lintec Corporation, Sumitomo Bakelite Co. Ltd., Denka Company Limited, Pantech Tape Co. Ltd., Ultron Systems, Inc., NEPTCO, Inc., Nippon Pulse Motor Taiwan, Loadpoint Limited, AI Technology, Inc., and Minitron Electronic GmbH.

Expansions & investments were one of the major strategic initiatives adopted by these players. Loadpoint Ltd. expanded its subcontract facility in the UK by adding a new 300mm diameter dicing saw, known as NanoAce. This investment helped the company consolidate its position in Europe.

These players also constantly invest in R&D activities in order to improve their services and product offerings. This was evident from the fact that Furukawa Electric Co. Ltd., one of the key players in Japan, spent nearly 1.3% of its revenue on R&D activities in 2015.

Report Scope

Attribute

Details

Base year for estimation

2015

Actual estimates/Historical data

2014 - 2015

Forecast period

2016 - 2025

Market representation

Revenue in USD Million, volume in million square meters & CAGR from 2016 to 2025

Regional scope

North America, Europe, Asia Pacific, Central & South America and Middle East & Africa

Country scope

U.S., Germany, France, China, South Korea, Brazil

Report coverage             

Revenue forecast, company share, competitive landscape, growth factors and trends

15% free customization scope (equivalent to 5 analyst working days)

If you need specific market information, which is not currently within the scope of the report, we will provide it to you as a part of customization


Segments covered in the report

This report forecasts revenue and volume growth at global, regional & country levels and provides an analysis of the industry trends in each of the sub-segments from 2014 to 2025. For the purpose of this study, Grand View Research has segmented the UV Tapes market by product, application, and region:

  • UV Tapes Product Outlook (Volume, Million Square Meters; Revenue, USD Million, 2014 - 2025)

    • Polyolefin (PO) 

    • Polyvinyl Chloride (PVC)

    • Polyethylene Terephthalate (PET) 

    • Other

  • Application Outlook (Volume, Million Square Meters; Revenue, USD Million, 2014 - 2025)

    • Wafer dicing

    • Back grinding

    • Others

  • Regional Outlook (Volume, Tons; Revenue, USD Million, 2014 - 2025)

    • North America

      • U.S.

    • Europe

      • Germany

      • France

    • Asia Pacific

      • China

      • South Korea

    • Central & South America

      • Brazil

    • Middle East & Africa

Key questions answered by the report
Request for Customization

Choose License Type:

Single User - $3,450
Multi User - $6,450
Enterprise User - $8,450

Special Pricing & Discounts

Avail customized purchase options to meet your research needs:

  • Buy sections of this report
  • Buy country level reports
  • Request for historical data
  • Request discounts available for Start-Ups & Universities

Why Choose Us

  • Research support

    24/5 Research support

    Get your queries resolved from an industry expert. Request for a free product review before report purchase.

  • Custom research service

    Custom research service

    Speak to the report author to design an exclusive study to serve your research needs.

  • Quality assurance

    Quality assurance

    A testimonial for service excellence represented in the form of BBB "A" Accreditation.

  • BBB Rating dandb
  • Information security

    Information security

    Your personal and confidential information is safe and secure.

  • BOA