The global electrostatic discharge packaging market involves the use of materials to protect devices that are sensitive to electrostatic discharges. Electrostatic discharge (ESD) packaging offers a vital solution to the storage of electronic components such as semiconductors and printed circuit boards (PCBs). It also aids in the safe transportation of these electronic products. Essentially, the properties of ESD in relation to packaging include resistance to antistatic charging (tribocharging), charge dissipation, and shielding of an electric charge.
By product, the ESD packaging market can be segmented into bags, trays, shrink films, foams, and clamshells among others. The bags segment accounts for the highest share in the market and includes types such as bubble (cushioned), conductive tubing, and static shielding. The customized production of ESD bags coupled with the convenience of transport has been augmenting product demand over the past few years and this trend is expected to continue over the forecast period.
A significant factor driving demand for ESD packaging is the growing need for smart devices along with miniaturization of such electronic devices. Another important factor necessitating the use of ESD packaging is the presence of various standards regarding the safety of ESD-prone devices during handling and shipping. In this regard, the electronics industry has set up accepted standards for manufacturers of electronic devices to show reasonable conformance.
Furthermore, ESD packaging technology finds application scope in end-use verticals such as automotive, defense and military, manufacturing, healthcare, aerospace among others. In the automotive industry, the primary function of this technology is to ensure/facilitate safe and secure handling and transport of high-value electronic parts/components and to minimize the cost of transport.
The electrostatic discharge packaging market has also witnessed an increasing adoption of ESD packaging technology in the automotive industry. This trend is expected to gain traction, especially in the Asia Pacific, considering the high performance of the automotive industry in the region. The growth of the global ESD packaging market is restrained by a host of challenges. Prominent among the restraining factors is the negative impact caused by the presence of metallic powder in the product. Metallic powders have been known to damage stored devices and components upon contact with water, thereby leading to corrosion.
Geographically, Asia Pacific holds the largest share in the product market owing to the concentration of manufacturers of electronic devices in countries such as Japan, China, and South Korea. The region has contributed significantly to the increasing demand for smart devices employing ESD packaging and is amply complemented by the rapidly growing consumer electronics industry in the region. The consumer electronics industry necessitates the use of ESD packaging for audio systems, smartphones, TVs, and so forth. The high rate of mobile phone subscriptions in this region has further driven the global industry and the trend is expected to continue over the forecast period.
The major market participants include BASF, Desco Industries, DowDuPont, PPG Industries, and TIP Corporation. The presence of large market participants has led to intense competition among key players. Among various strategies deployed by prominent players, customized ESD packaging has turned out to be rewarding and has given market players ample scope to extend their global reach. Further, to withstand competition in the market, market players have been capitalizing on the benefits of mergers and acquisitions. As far as the small and medium-sized ESD packaging manufacturers are concerned, focusing on product innovation has propelled these manufacturers to gain a foothold in the global electrostatic discharge packaging market.
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