Semiconductor Assembly & Packaging Equipment Market To Reach $9,209.0 Million By 2033

Semiconductor Assembly & Packaging Equipment Market Growth & Trends

The global semiconductor assembly and packaging equipment market size is anticipated to reach USD 9,209.0 million by 2033 and is projected to grow at a CAGR of 8.4% from 2025 to 2033, according to a new report by Grand View Research, Inc. The global semiconductor assembly and packaging equipment industry is primarily driven by the increasing demand for compact, high-performance electronics such as smartphones, laptops, and wearable devices. As the size of electronic components shrinks while functionality grows, advanced packaging technologies like wafer-level and 3D/2.5D integration become essential.

Another significant driver is the rapid adoption of technologies like artificial intelligence (AI), Internet of Things (IoT), and 5G communication. These technologies require high-bandwidth and energy-efficient semiconductor devices, which depend on sophisticated packaging formats. Demand for flip chip, fan-out, and system-in-package (SiP) solutions has surged as a result. Consequently, equipment suppliers that support these packaging methods are witnessing increased orders and capacity expansion.

The expansion of global OSAT (Outsourced Semiconductor Assembly and Test) services is also contributing to market momentum. As fabless companies rely more on OSATs for high-volume packaging, there is a growing need for cost-effective and scalable equipment. This includes die bonders, molding systems, wire bonders, and solder plating machines. The demand for flexible and efficient tools that can support varied packaging formats is driving innovation among equipment manufacturers.        

Regional government initiatives and semiconductor incentive programs are playing a crucial role in market growth. Countries like the U.S., China, India, and those in the EU are investing heavily in domestic semiconductor ecosystems, which include backend assembly and packaging infrastructure. These programs are encouraging new fabs and packaging facilities, boosting demand for high-end assembly equipment. In addition, increased focus on supply chain localization is promoting long-term equipment adoption across regions.

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Semiconductor Assembly & Packaging Equipment Market Report Highlights

• Based on product, the bonding equipment segment accounted for the largest market revenue share in 2024, owing to its crucial role in die and wire bonding processes across advanced packaging formats. Its widespread adoption in 3D integration and high-density assemblies further supported its dominance.

• Based on end use, the IDMs segment led the market with the largest revenue share of 55.3% in 2024. Driven by their in-house packaging capabilities and high-volume production. Their investment in advanced packaging technologies further reinforced their market leadership.

• Based on packaging type, the wafer level packaging equipment segment accounted for the largest market revenue share in 2024, owing to its ability to deliver compact, high-performance semiconductor solutions. WLP enables reduced form factors and improved electrical performance, making it ideal for smartphones and wearable devices. Its compatibility with high-volume manufacturing further boosted its adoption across IDMs and OSATs.

• In January 2024,SCREEN Holdings launched operations at its newly constructed S³-5 production facility in Hikone, designed to expand manufacturing capacity for semiconductor cleaning systems. The three-story building spans around 13,500 square meters and was built with an investment of approximately ¥8 billion. It will focus on producing advanced single-wafer cleaning equipment to meet growing chip industry demand. The site also integrates eco-friendly systems to reduce environmental impact.

Semiconductor Assembly & Packaging Equipment Market Segmentation

Grand View Research, Inc. has segmented the global semiconductor assembly and packaging equipment market based on the product,packaging type, end-use, and region.

Semiconductor Assembly & Packaging Equipment Packaging Type Outlook (Revenue, USD Million, 2021 - 2033)

• Flip Chip Packaging Equipment

• Wafer Level Packaging (WLP) Equipment

• Fan-Out Packaging Equipment

• System-in-Package (SiP) Equipment

• 3D/2.5D Packaging Equipment

• Others

Semiconductor Assembly & Packaging Equipment End-use Outlook (Revenue, USD Million, 2021 - 2033)

• IDMs (Integrated Device Manufacturers)

• OSAT (Outsourced Semiconductor Assembly and Test)

Semiconductor Assembly & Packaging Equipment Product Outlook (Revenue, USD Million, 2021 - 2033)

• Dicing Equipment

  • Scriber

  • Dicer

  • Wafer Mounting Equipment

• Bonding Equipment

  • Die Bonder

  • Wire Bonder

  • Others

• Packaging Equipment

  • Molding Equipment

  • Solder Plating Equipment

  • Deflasher

  • Others

• Others

Semiconductor Assembly & Packaging Equipment Regional Outlook (Revenue, USD Million, 2021 - 2033)

• North America

  • U.S.

  • Canada

  • Mexico

• Europe

  • Germany

  • France

  • Italy

  • Spain

  • UK

  • Netherlands

• Asia Pacific

  • China

  • India

  • Japan

  • South Korea

  • Taiwan

• Latin America

  • Brazil

• Middle East and Africa

  • Israel

  • South Africa

List of Key Players in the Semiconductor Assembly & Packaging Equipment Market

• Applied Materials

• ASM Pacific Technology

• Veeco Instruments Inc.

• Besi

• Disco Corporation

• Kulicke & Soffa Industries, Inc. (K&S)

• Lam Research Corporation

• Nikon Corporation

• Plasma-Therm

• Rudolph Technologies, Inc.

• SCREEN Semiconductor Solutions Co., Ltd.

• SUSS MicroTec SE

• Teradyne, Inc.

• Tokyo Electron Limited (TEL)

• Ultratech, Inc.