Microcontroller Socket Market Analysis By Product (DIP, BGA, QFP, SOP, SOIC), By Application (Industrial, Consumer Electronics, Automotive, Medical Devices, Military & Defense), By Region, And Segment Forecasts, 2018 - 2024

Industry Insights

The global microcontroller socket market size was valued at USD 843.7 million in 2015. The increasing microcontroller application in the communication, automobile, and industrial sectors has boosted the growth of the package market over the forecast period. Microcontrollers are installed in electronic devices and control various operations performed by the devices. The technology helps in the seamless management of electronic devices.

QFP market by region, 2014 - 2024 (USD Million)

The market for low-power embedded systems is expected to accelerate as the technology offers low power consumption, optimal data bandwidth, and rich interface support. The increasing demand for enhanced technology, which reduces fuel consumption, is also expected to drive the industry growth. Manufacturers are also aiming at designing and manufacturing powertrain applications, which, in turn, would positively impact the packages market.

The increasing IC packaging developments delivering a high application in a low-cost, low-profile, and low-power design have led to the growth of integrated circuits. OEMs, system developers, foundries, packaging and test subcontractors, chip manufacturers, and fabless chip companies are placing high-risk, high-stakes bets on the next generation packaging solutions that are able to deliver faster, better, cheaper results than the advances in wafer processing.

The increasing demand for usability and mobility is driving miniaturization, leading to reduced weight and power consumption. This has resulted in an enhanced functionality per chip with higher input and output as well as a smaller package size that lowers the package height and the loop. Furthermore, copper wire reduces the packaging cost significantly while providing increased productivity.

Application Insights

The application segment is segregated into five broad categories, which include automotive, consumer electronics, industrial, medical devices, and military & defense. The automotive segment is expected to be second largest application segment after industrial with a share of more than 25% in 2015.

The application in the automotive segment includes body electronics, driving safety, and information devices for supporting a small design and offering a high level of integration, which will further enhance the demand over the forecast period. The growing demand for smart energy for metering and power line communications is also expected to fuel the industrial application demand over the forecast period. Smart meters offer high accuracy, which helps in improving the performance of meters and has led to an enhanced demand in the industry.

Product Insights

Based on products, the market is segmented into Dual In-line Package (DIP), Ball Grid Array (BGA), Quad Flat Package (QFP), Small Outline Package (SOP), and Small Outline IC Package (SOIC).

Microcontroller socket market, by product, 2015 (%)

The BGA microcontroller socket is also expected to exhibit a significant growth over the forecast period on account of the increasing demand from the industrial sector. BGAs are used for integrated circuits and area type of surface-mount packaging. These products are descended from the Pin Grid Array (PGA). They are a package with one face covered with pins in a grid pattern, which, in operation, conducts electrical signals between the printed circuit board and the integrated circuit.

Regional Insights

Asia Pacific microcontroller socket market is expected to grow significantly over the forecast period owing to the increasing demand growth in countries such as Japan and China. The increasing demand of sockets in the microelectronics industry in various applications has led to the enhanced growth.

The North American microcontroller socket market is also expected to grow steadily over the forecast period owing to the increasing development in the smart energy sector and wireless communications sector.

Competitive Insights

The key players are focused on product development and innovations within the industry. The vendors are opting for mergers & acquisitions and strategic alliances for maintaining their dominance and expanding their business in the market.

Socket manufacturers are developing enhanced designs for the purpose of interconnecting solutions for high I/O, fine pitch, low profile applications, and adhering to the severe regulations of performance and reliability. The key industry competitors include Aries Electronics (U.S.), Mill-Max Mfg. Corporation (U.S.), Samtec, Inc. (U.S.), and CNC Tech LLC (U.S.).

Report Scope

Segments Covered in the Report

This report forecasts revenue growth on the global, regional, & country levels and provides an analysis of the latest trends and opportunities in each of the sub-segments from 2014 to 2024. For the purpose of this study, Grand View Research has segmented the microcontroller socket market on the basis of product, application, and region:

• Product Outlook (Revenue, USD Million; 2014 - 2024)

  • DIP

  • BGA

  • QFP

  • SOP

  • SOIC

• Application Outlook (Revenue, USD Million; 2014 - 2024)

  • Automotive

  • Consumer Electronics

  • Industrial

  • Medical Devices

  • Military & Defense

• Region Outlook (Revenue, USD Million; 2014 - 2024)

  • North America

  • Europe

  • Asia Pacific

  • Latin America

  • Middle East & Africa (MEA)