GVR Report cover Through-hole Passive Components Market (2026 - 2033)Report

Through-hole Passive Components Market (2026 - 2033)

Size, Share & Trends Analysis Report By Component (Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors), By Leads Model, By Application, By Region, And Segment Forecasts

Market Size, 2025

$43.4B

Market Estimate, 2026

$46.2B

Market Forecast, 2033

$71.1B

CAGR, 2026–2033

6.4%

Through-hole Passive Components Market Report Summary

The global through-hole passive components market size was valued at USD 43.4 billion in 2025 and is projected to grow from USD 46.2 billion in 2026 to USD 71.1 billion by 2033, at a CAGR of 6.4% from 2026 to 2033. Asia Pacific dominated the market, accounting for a revenue share of 49.0% in 2025. The market growth can be attributed to the increasing penetration of connected devices and the steadily rising demand across the medical and automotive industries.

Through-hole Passive Components market size and growth forecast (2023-2033)Source: Grand View Research, IR Documents, Primary Interviews, Paid Databases

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Key Market Trends & Insights

  • By component: The capacitor segment held the largest market share of more than 43.0% in 2025.
  • By lead model: The axial lead segment held the largest market share of more than 75.0% in 2025.
  • By application: The consumer electronics segment held the largest market share of more than 32.0% in 2025.

Regional Highlights

  • Largest regional market: Asia Pacific (49.0% revenue share, 2025)
  • Fastest-growing regional market: Asia Pacific (highest CAGR, 2026-2033)

Market Size & Forecast

  • Market size in 2025: USD 43.4 Billion
  • Estimated market size in 2026: USD 46.2 Billion
  • Projected market size by 2033: USD 71.1 Billion
  • CAGR (2026-2033): 6.4%
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Programmable Logic Controllers (PLCs) are industrial computers used to control electrical and mechanical processes, and they commonly incorporate through-hole passive components. These modules are drilled into printed circuit boards rather than surface-mounted, making them highly durable and better equipped to withstand a range of pressures and forces.

The rise of Industry 4.0 and its evolution toward Industry 5.0 continue to significantly strengthen demand across the market, particularly as industries adopt AI-driven smart manufacturing ecosystems. For instance, SPS 2025, held in November 2025 in Nuremberg, highlighted the growing integration of artificial intelligence in industrial processes. It emphasized a shift beyond traditional Industry 4.0 toward more human-centric, AI-assisted manufacturing models aligned with Industry 5.0, in which collaboration among humans, machines, and intelligent systems improves production efficiency, flexibility, and customization.

The growing adoption of connected devices across industries, such as security systems, smart meters, gaming consoles, home appliances, and smartphones, is driving demand for innovative through-hole passive components. Manufacturers are also focusing on providing breakthrough solutions that could drive increased use of this technology in connected devices. An increasing number of IoT end-node applications demand connected devices that operate on batteries lasting months or years without replacement or maintenance, creating lucrative opportunities for market growth. For instance, in October 2025, Siemens significantly expanded its portfolio by advancing industrial AI, digital twin, and software-defined automation technologies through its Siemens Xcelerator ecosystem.

Government initiatives aimed at supporting industrial automation are also creating promising growth opportunities for the market. In April 2025, the Government of India launched the Electronics Component Manufacturing Scheme (ECMS) with a financial outlay of around USD 2.7 billion. Such initiatives are accelerating domestic electronics production and strengthening component supply chains. Rising investments in industrial automation infrastructure and electronics manufacturing are expected to drive steady demand for through-hole passive components, particularly in power management, control systems, and industrial equipment applications.

Analyst Perspective

The shift from Industry 4.0 toward Industry 5.0 is being driven by the rapid integration of AI-enabled automation across manufacturing ecosystems. Growing adoption of intelligent technologies, including production planning, predictive maintenance, digital twin solutions, and real-time monitoring systems, is improving operational efficiency, flexibility, and productivity across industries. This evolution is accelerating the transition toward human-centric smart manufacturing environments, where machines, intelligent systems, and workers collaborate more seamlessly. As industries continue investing in connected infrastructure and advanced electronic systems, demand for reliable electronic components is expected to rise steadily, supporting market growth for through-hole passive components across industrial, automotive, energy, telecommunications, and other critical applications.

Component Insights

The capacitor segment led the market with the largest revenue share of more than 43.0% in 2025. The growing popularity of the capacitor segment is attributed to the rising demand for electronics and electrical products in sectors such as medical and healthcare, industrial, telecommunication, and automotive. Most of these business sectors use power circuit boards, directly or indirectly, across multiple devices, including major medical devices, industrial robots, home appliances, and network devices, to perform functions such as receiving and transmitting data. These circuit boards have through-hole passive components integrated to perform tasks such as circuit configuration, power stability, and power conversion, which are crucial for an electronic gadget to function properly. Therefore, with the increasing production of various home appliances, industrial digital devices, and other consumer electronics, the demand for capacitors is projected to grow rapidly over the forecast period.

The sensors segment is expected to grow at the fastest CAGR over the forecast period. Sensors detect changes in environmental conditions and convert them into measurable outputs that support monitoring, control, and automation functions. Through-hole sensors play a critical role in improving operational accuracy, consistency, and reliability across various industries by enabling real-time data collection and feedback-driven decision-making. Their adoption continues to expand across applications such as fault detection, temperature monitoring, smart lighting, traffic management, industrial automation, and automotive safety systems, including Advanced Driver Assistance Systems (ADAS) and autonomous driving. These factors are driving segment growth.

For instance, in November 2025, ABB’s deployment of advanced Ethernet-APL-enabled industrial sensors for real-time monitoring and predictive maintenance applications demonstrates the growing integration of smart sensor technologies in industrial automation systems. Moreover, rising integration of AI-enabled sensing technologies across industrial and automotive systems is further supporting demand for advanced through-hole sensors across multiple end-use industries.

Lead Type Insights

The axial lead segment led the market with the largest revenue share of more than 75.0% in 2025, and is also expected to grow at the fastest CAGR over the forecast period. Axial lead components provide mechanical stability to the circuit board assembly. The leads are typically longer and cylindrical, providing a strong anchoring point when soldered to the circuit board. This enhances the overall durability and resistance to mechanical stress, ensuring that the components remain securely in place even under harsh operating conditions.

The axial lead configuration offers improved thermal management capabilities. The extended leads and cylindrical shape allow for better heat dissipation. This is particularly advantageous in applications where a significant amount of heat is generated during the operation. The axial lead configuration facilitates efficient heat transfer from the component to the circuit board, reducing the risk of overheating and enhancing the system's overall reliability.

Application Insight

The consumer electronics segment led the market with the largest revenue share of more than 32.0% in 2025, characterized by a high demand for electronic devices such as smartphones, televisions, computers, gaming consoles, and home appliances. These devices require a diverse range of through-hole components for their functionality, including resistors, capacitors, diodes, and transistors. The sheer volume of consumer electronics production contributes to the significant market demand for these modules. Consumer electronics often require repairs or part replacements throughout their lifespan. Through-hole components are advantageous in this context because they can be easily desoldered and replaced, enabling efficient repair and serviceability. This ease of repair reduces maintenance costs and enhances the overall customer experience, as consumers can have their devices repaired or upgraded without extensive downtime or expense.

The industrial segment is expected to grow at the fastest CAGR over the forecast period. Through-hole components are renowned for their robust construction and durability, making them highly suitable for industrial applications. Industries such as manufacturing, automation, energy, and transportation often operate in harsh environments with extreme temperatures, vibrations, and electrical noise. Through-hole components, with their secure soldered connections and mechanical stability, can withstand these challenging conditions, ensuring reliable and long-lasting performance in industrial settings. The demand for security cameras, sensor-based devices, and robotic systems is increasing rapidly across industrial applications, including process automation and remote monitoring.

In addition, the adoption of robots in manufacturing has increased, which further increases the adoption of through-hole passive components. For instance, in September 2025, according to the International Federation of Robotics (IFR) World Robotics 2025 report, 542,000 industrial robots were installed globally in 2024, marking the second-highest annual installation count on record. This growing deployment of industrial robots is expected to drive demand for durable, reliable through-hole passive components that withstand vibration, temperature fluctuations, and other harsh operating conditions.

Regional Insights

The through-hole passive components market in North America has a robust industrial sector comprising manufacturing, automation, aerospace, defense, and energy industries. These industries rely heavily on through-hole components for applications such as machinery control, power electronics, robotics, and infrastructure development. The continuous growth and innovation in these sectors fuel demand for these modules in North America. The automotive industry is a significant driver of the North American market. The region is home to numerous automobile manufacturers and suppliers, and through-hole components are extensively used in automotive electronics and systems.

The increasing adoption of advanced driver assistance systems (ADAS), electric vehicles (EVs), and connectivity features in vehicles drives the demand for through-hole components in the automotive sector. For instance, in June 2025, General Motors (GM) announced plans to invest approximately USD 4 billion in its U.S. manufacturing facilities across Michigan, Kansas, and Tennessee to expand production of both conventional and electric vehicles. Such investments are expected to drive demand for through-hole components used in automotive electronics, power management systems, control units, and vehicle infrastructure.

Asia Pacific Through-hole Passive Components Market Trends

Asia Pacific dominated the global through-hole passive components market with the largest revenue share of approximately 49.0% in 2025, and is expected to grow at the fastest CAGR over the forecast period. The growth of the regional market can be attributed to the lucrative opportunities it offers for implementing these modules across several industries, including automotive, consumer electronics, and industrial applications. Rapid implementation of robotic processes in Japan, South Korea, India, and China across various industries and verticals, especially in the automotive and consumer electronics sectors, is driving demand across the region. The initiatives being pursued by various governments in the Asia Pacific, such as India’s Scheme for Manufacturing Electronic Components and Semiconductors, which envisages government incentives for manufacturers, are expected to play a vital role in driving growth in the regional market over the forecast period.

Through-hole Passive Components Market Trends, by Region, 2026 - 2033

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Key Through-hole Passive Components Company Insights

The global through-hole passive components industry is fragmented and is anticipated to witness increased competition due to the presence of several players. Key industry participants in the through-hole passive components market include Vishay Intertechnology, Inc.; YAGEO Group; Murata Manufacturing Co., Ltd.; KYOCERA AVX Components Corporation; Panasonic Holdings Corporation; Bourns, Inc.; TDK Corporation; TE Connectivity; Microchip Technology Inc.

Most key players belong to the U.S. and Japan. A considerable share of revenue is held by four major players: Vishay, TDK Corporation, Murata Manufacturing Co., Ltd., and Panasonic Holding Corporation.

The remaining market share is distributed among several medium and small players. New product launches and mergers & acquisitions are the key strategies these players adopt to gain a significant foothold in the market. Several key players are launching new components with improved performance to expand their market share, broaden their product portfolios, and pursue regional expansion.

Key Through-hole Passive Components Companies

The following key companies have been profiled for this study on the global through-hole passive components market:

  • Vishay Intertechnology, Inc.

  • YAGEO Group

  • Murata Manufacturing Co., Ltd.

  • KYOCERA AVX Components Corporation

  • Panasonic Holdings Corporation

  • Bourns, Inc.

  • TDK Corporation

  • TE Connectivity

  • Microchip Technology Inc.

Recent Developments

  • In January 2026, Vishay Intertechnology expanded its 193 PUR-SI series of snap-in power aluminum electrolytic capacitors by introducing new 550 V and 600 V voltage ratings. The enhanced capacitors deliver up to 30% higher ripple current and are designed for high-voltage power electronics applications, enabling designers to reduce component count and improve system reliability.

  • In August 2025, Vishay Intertechnology introduced new automotive-grade IHDM edge-wound through-hole inductors capable of operating at temperatures up to +180°C. Designed for automotive, industrial, and high-current power applications, the inductors offer improved heat dissipation, high saturation current, and enhanced reliability under demanding operating conditions.

Through-hole Passive Components Market Report Scope

Report Attribute

Details

Market size in 2025

USD 43.4 billion

Estimated market size in 2026

USD 46.2 billion

Projected market size by 2033

USD 71.1 billion

Growth rate

CAGR of 6.4% from 2026 to 2033

Base year for estimation

2025

Historical data

2021 – 2024

Forecast period

2026 – 2033

Quantitative units

Revenue in USD million/billion and CAGR from 2026 to 2033

Report coverage

Revenue forecast, company ranking, competitive landscape, growth factors, and trends

Segments covered

Component, leads model, application, region

Regional scope

North America; Europe; Asia Pacific; Latin America; Middle East & Africa

Country scope

U.S.; Canada; UK; Germany; France; China; India; Japan; South Korea; Vietnam; Singapore; Brazil; Mexico.

Key companies profiled

Vishay Intertechnology, Inc.; YAGEO Group; Murata Manufacturing Co., Ltd.; KYOCERA AVX Components Corporation; Panasonic Holdings Corporation; Bourns, Inc.; TDK Corporation; TE Connectivity; Microchip Technology Inc.

Customization scope

Free report customization (equivalent up to 8 analysts working days) with purchase. Addition or alteration to country, regional & segment scope.

Pricing and purchase options

Avail of customized purchase options to meet your exact research needs. Explore purchase options

Global Through-hole Passive Components Market Report Segmentation

This report forecasts revenue growth at the global, regional, and country levels and provides an analysis of the latest industry trends and opportunities across each sub-segment from 2021 to 2033. For this study, Grand View Research has segmented the global through-hole passive components market report based on component, leads model, application, and region:

  • Component Outlook (Revenue, USD Billion, 2021 - 2033)

    • Resistors

    • Capacitors

    • Inductors

    • Diodes

    • Transducers

    • Sensors

    • Others

  • Leads Model Outlook (Revenue, USD Billion, 2021 - 2033)

    • Axial Leads

      • Resistors

      • Capacitors

      • Inductors

      • Diodes

      • Transducers

      • Sensors

      • Others

    • Radial Leads

      • Resistors

      • Capacitors

      • Inductors

      • Diodes

      • Transducers

      • Sensors

      • Others

  • Application Outlook (Revenue, USD Billion, 2021 - 2033)

    • Consumer Electronics

      • Mobile Phones

      • Personal Computers

      • Home Appliances

      • Audio and Video Systems

      • Storage Devices

      • Others

    • IT & Telecommunication

      • Telecom Equipment

      • Networking Devices

    • Automotive

      • Driver Assistance Systems

      • Infotainment Systems

      • Others

    • Industrial

      • Industrial Automation and Motion Control

      • Mechatronics and Robotics

      • Power Electronics

      • Photovoltaic Systems

      • Others

    • Aerospace & Defense

      • Aircraft Systems

      • Military Radars

      • Others

    • Healthcare

      • Medical Imaging Equipment

      • Consumer Medical Devices

      • Others

    • Others

  • Regional Outlook (Revenue, USD Billion, 2021 - 2033)

    • North America

      • U.S.

      • Canada

    • Europe

      • UK

      • Germany

      • France

    • Asia Pacific

      • China

      • India

      • Japan

      • South Korea

      • Vietnam

      • Singapore

    • Latin America

      • Brazil

      • Mexico

    • Middle East & Africa

Frequently Asked Questions About This Report

About the Author(s)

Semiconductor & Electronics Research Team

Industry · Semiconductor & Electronics

This report was authored by the semiconductor & electronics research team at Grand View Research - comprising two research analysts, one senior research analyst, and one industry expert - with specialized expertise in the semiconductor & electronics segment of the industry industry. All findings are based on proprietary industry databases, executive interviews, and regulatory analysis, subject to internal peer review prior to publication.

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